• BGA Placement / Rework
    Removal and replacement of Ball Grid Array (BGA) devices right down to micro BGA format.
  • Rapid Prototyping on PCBs
    Fast turnaround
    Excellent build quality
    Pressfit assembly with minimal tooling costs.
  • Volume circuit and system production
    Fully automated high-speed surface mount lines with placement capabilities ranging from 0201 and 0402 package sizes.
  • X-Ray and Visual Inspection
    Many years of expertise interpreting X-ray images. We carry out 100% X-ray inspection on ALL BGA devices.
  • Functional Tests
    Highly experienced team of test/repair engineers with a vast knowledge of many types of electronic systems.

Welcome to Power Action

  • Service

    Fast turnaround times coupled with responsive and motivated staff are an integral part of the Power Action Ltd philosophy.

  • Quality

    We are a full-service Contract Manufacturer. Certified to ISO 9001:2015.

  • Experience

    20th Anniversary year. Produced over 4 million electronic assemblies. Experts in the field of electronic manufacture.